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Chip Industry Needs More Trust, Not Zero Trust
CISOs from Intel, TSMC, ASML, Applied Materials, and Lam Research unanimously called for the semiconductor industry to pull together to share information and develop cybersecurity protocols as a...
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Week In Review: Auto, Security, Pervasive Computing
Google was hit with a class action suit in U.S. District Court in San Francisco, alleging data scraping from millions of users without consent and violation of copyright laws to train and develop its...
View ArticleWeek In Review: Design, Low Power
Cadence will acquire Rambus’ SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction,...
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High-NA Lithography Starting To Take Shape
The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes despite an almost perpetual...
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Week In Review: Manufacturing, Test
The Chinese government is considering easing proposed rules that require foreign office equipment makers operating in the country to transfer key product technology to China, per Nikkei Asia. In April...
View ArticleWeek In Review: Semiconductor Manufacturing, Test
China’s restrictions on the export gallium and germanium took effect this week. Any Chinese company exporting gallium or germanium that could be used in military and civil applications (dual-use) must...
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Securing Chip Manufacturing Against Growing Cyber Threats
Semiconductor manufacturers are wrestling with how to secure a highly specialized and diverse global supply chain, particularly as the value of their IP and their dependence upon software increases —...
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Power Semis Usher In The Silicon Carbide Era
Silicon carbide production is ramping quickly, driven by end market demand in automotive and price parity with silicon. Many thousands of power semiconductor modules already are in use in electric...
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When And Where To Implement AI/ML In Fabs
Deciphering complex interactions between variables is where machine learning and deep learning shine, but figuring out exactly how ML-based systems will be most useful is the job of engineers. The...
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Building Better Bridges In Advanced Packaging
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced packaging. And while that opens up a slew...
View ArticleChip Industry Talent Shortage Drives Academic Partnerships
Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and...
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Gearing Up For Hybrid Bonding
Hybrid bonding is becoming the preferred approach to making heterogeneous integration work, as the semiconductor industry shifts its focus from 2D scaling to 3D scaling. By stacking chiplets vertically...
View ArticleNew Insights Into IC Process Defectivity
Finding critical defects in manufacturing is becoming more difficult due to tighter design margins, new processes, and shorter process windows. Process marginality and parametric outliers used to be...
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Chip Industry Week In Review
By Jesse Allen, Karen Heyman, and Liz Allan Japan’s Rapidus and the University of Tokyo are teaming up with France’s Leti to meet its previously announced mass production goal of 2nm chips by 2027, and...
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Chip Industry Week In Review
By Jesse Allen, Gregory Haley, and Liz Allan Synopsys acquired Imperas, pushing further into the RISC-V world with Imperas’ virtual platform technology for verifying and emulating processors. Synopsys...
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Modeling Compute In Memory With Biological Efficiency
The growing popularity of generative AI, which uses natural language to help users make sense of unstructured data, is forcing sweeping changes in how compute resources are designed and deployed. In a...
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Fabs Begin Ramping Up Machine Learning
Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions...
View ArticleMoney Pours Into New Fabs And Facilities
Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs,...
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Chip Industry Week In Review
By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap...
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Chip Industry Week In Review
By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company...
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