Clik here to view.
NAND Flash Targets 1,000 Layers
The chip industry is pushing to quadruple the stack height of 3D NAND flash from 200 layers to 800 layers or more over the next few years, using the additional capacity will help to feed the unending...
View ArticleGlobal IC Fabs And Facilities Report: 2024
The chip industry made significant capital investments this year to build new fabs and facilities or expand existing premises. A number of sites were dedicated to SiC, GaN, DRAM, HBM, along with...
View ArticleClik here to view.
Universities Augment Engineering Curricula To Boost Employability
Increasing numbers of universities are offering semiconductor courses in their engineering programs, and also in math, physics, and business degrees. Most universities now offer a broad foundation so...
View ArticleClik here to view.
Chip Industry Week In Review
Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group....
View ArticleClik here to view.
Chip Industry Week In Review
The EU Commission approved €920 million in German State aid to support Infineon in setting up its Smart Power Fab in Dresden. Total funding for the Dresden site amounts to about €1 billion. PDF...
View ArticleClik here to view.
Nearly Invisible: Defect Detection Below 5nm
Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect,...
View ArticleClik here to view.
Chip Industry Week In Review
[Podcast version is here.] TSMC said it will produce 30% of its leading-edge chips in Arizona when all six of its fabs are operational, a total investment of $165 billion, Axios reported. In its latest...
View ArticleClik here to view.
Chip Industry Week in Review
To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week’s North America Technology Symposium, including future architectures for 3D-ICs for...
View ArticleClik here to view.
E-Beam Inspection Proves Essential For Advanced Nodes
Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs....
View ArticleClik here to view.
Chip Industry Week in Review
Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan...
View Article