Week In Review: Manufacturing, Test
Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here’s another report. The The U.S. and China are in the...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers The IC industry once had several leading-edge vendors that invested and built new fabs. But over time, the field has narrowed due to soaring costs and a dwindling customer base. In 1994, the...
View ArticleBlog Review: Nov. 13
Applied Materials’ Buvna Ayyagari-Sangamalli argues that the siloed structure that produced the computing eras of the past will not be sufficient to fuel the AI era and that a new codesign approach to...
View ArticleWeek In Review: Manufacturing, Test
Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from...
View ArticleBlog Review: Nov. 20
Arm’s Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is...
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Foldable Phones Bend The Limits Of Technology
After years of discussion about flexible, bendable displays for mobile electronic devices, the first and most logical of these devices, foldable phones, will hit the market this year — along with some...
View ArticleA New Playbook For The AI Era
It’s Q4 in Silicon Valley, which means that most tech enterprises are in strategic planning mode, taking stock of where they are today and charting a course for where they want to be over the next few...
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DRAM Scaling Challenges Grow
DRAM makers are pushing into the next phase of scaling, but they are facing several challenges as the memory technology approaches its physical limit. DRAM is used for main memory in systems, and...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best...
View ArticleBlog Review: Nov. 27
Arm’s Ben Fletcher digs into what’s needed to make wireless 3D integration a reality from a tool to automate the design and optimization process for inductors used in wireless 3D-ICs to exploring how...
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What’s Next For High Bandwidth Memory
A surge in data is driving the need for new IC package types with more and faster memory in high-end systems. But there are a multitude of challenges on the memory, packaging and other fronts. In...
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Co-Design For The AI Era
Welcome to the second piece in our blog series examining how the computing industry can work in new ways to enable the AI Era. In our first blog, my colleague Ellie Yieh described the enormous...
View ArticleWhere Technology Breakthroughs Are Needed
After years of delays, extreme ultraviolet (EUV) lithography is finally in production at the 7nm logic node with 5nm in the works. EUV, a next-generation lithography technology, certainly will help...
View ArticleBlog Review: Jan. 15
Cadence’s Paul McLellan looks back at the history of lithography, from its fundamental equation to multiple patterning and the challenges facing EUV today. Synopsys’ Taylor Armerding warns that medical...
View ArticleWeek In Review: Manufacturing, Test
Fab tools, chips and technologies What happened at the SEMI Industry Strategy Symposium (ISS) this week? The annual three-day conference of executives gave the year’s first comprehensive outlook of the...
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5/3nm Wars Begin
Several foundries are ramping up their new 5nm processes in the market, but now customers must decide whether to design their next chips around the current transistor type or move to a different one at...
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Finding Defects In EUV Masks
Extreme ultraviolet (EUV) lithography is finally in production at advanced nodes, but there are still several challenges with the technology, such as EUV mask defects. Defects are unwanted deviations...
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AI And Big Data Set To Reinvent Semiconductor Industry
The recent IEEE International Electron Devices Meeting (IEDM) reaffirmed that the semiconductor industry is in a period of reinvention as we grapple with the challenges and opportunities promised by...
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SiC Foundry Business Emerges
Several third-party foundry vendors are entering or expanding their efforts in the silicon carbide (SiC) business amid booming demand for the technology. However, making a significant dent in the...
View ArticleBlog Review: Feb. 5
Cadence’s Paul McLellan checks out the different ways persistent memories can be used, as well as a basic persistent programming model and key things hardware needs to support. In a video, Mentor’s...
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