Week In Review: Manufacturing, Test
The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a...
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AI/Edge The United States now has the highest number of COVID-19 cases, and the state governments in the U.S. are asking technologists for help, according to a story in The Washington Post. Data...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers TSMC has announced its intention to build and operate an advanced semiconductor fab in the U.S. The fab, to be built in Arizona, will utilize TSMC’s 5nm technology and will produce 20,000...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers and OEMs Senator Patrick Leahy (D-Vt.), Senator Chuck Schumer (D-N.Y.) and Senator Jack Reed (D-R.I.) have sent a letter to officials from the Trump administration, demanding answers about...
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Fab tools, packaging/test VLSI Research has released its 200mm wafer fab equipment (WFE) market share figures for 2019. The top three suppliers–Applied Materials, TEL, and ASML—saw growth in the 2019...
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Atomic Layer Etch Expands To New Markets
The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology...
View ArticleSemicon West Day One/Two
For years, the semiconductor and equipment industry has congregated at the annual Semicon West trade show in San Francisco. It’s an event to get an update on the latest equipment, test and packaging...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers At its Architecture Day this week, Intel disclosed its roadmap for the company’s next-generation microprocessors, graphics chips, FPGAs and other products. As part of the event, Intel...
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Finding Defects With E-Beam Inspection
Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these...
View ArticleWeek In Review: Auto, Security, Pervasive Computing
Synopsys announced an electronic and photonic co-design platform for photonic integrated circuit (PIC) design, layout implementation, and verification. The OptoCompiler provides schematic-driven layout...
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Upturn Seen In Semi Equipment Biz
Business continues to get better in the semiconductor equipment sector. VLSI Research, for one, has raised its forecast in the arena. But there is still some uncertainty amid mixed growth for...
View ArticleDeals That Change The Chip Industry
Nvidia’s pending $40 billion acquisition of Arm is expected to have a big impact on the chip world, but it will take years before the effects of this deal are fully understood. More such deals are...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers and OEMs Apple has introduced a new MacBook Air, 13-inch MacBook Pro, and Mac mini powered by the M1, the first in a family of chips designed by Apple specifically for the Mac. Based on a...
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200mm Demand Surges
A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a...
View ArticleBlog Review: Dec. 23
Cadence’s Paul McLellan checks out how Arm is becoming a powerhouse in the server and high-end space with the addition of new R&D and a focus on getting the most out of its architecture. Siemens...
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Market research For some time, China has faced an enormous trade gap in semiconductors. In response, China has been developing its semiconductor industry with plans to make more of its chips. But China...
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Stronger, Better Bonding In Advanced Packaging
System-in-package integrators are moving toward copper-to-copper direct bonding between die as the bond pitch goes down, making the solder used to connect devices in a heterogenous package less...
View ArticleManufacturing Bits: Feb. 16
Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for...
View ArticleWeek In Review: Manufacturing, Test
Chipmakers and OEMs A severe winter storm has hit many parts of the United States, including Texas. In Austin, utility providers are prioritizing service to residential areas. As a result, electricity...
View ArticleWeek In Review: Design, Low Power
Cadence completed the acquisition of NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries...
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