Week In Review: Manufacturing, Test
Test There is more consolidation in the ATE business. In October, Cohu completed the acquisition of Xcerra, a supplier of ATE and other products. Then, Astronics this week entered into an agreement for...
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Chipmakers GlobalFoundries has announced that its advanced silicon-germanium (SiGe) offering is available for prototyping on 300mm wafers. GF’s SiGe technology has been shipping on its 200mm production...
View ArticleBlog Review: Dec. 5
Mentor’s Harry Foster digs into verification effectiveness in FPGA projects and what it means that so many non-trivial bugs escape into production. Cadence’s Paul McLellan checks out an effort to...
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November Startup Funding: Big Deals Dominate
A dozen tech startups involved in mobility, software, cybersecurity, robotics and smart payment terminals each raised $100 million or more in November. Big deals in automation, transportation sharing...
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Fab tools/manufacturing Lam Research has accepted Martin Anstice’s resignation as chief executive and a member of the board. Lam has named Tim Archer as president and chief executive effective...
View ArticleIndustry 4.0 Reaches Into the Subfab
To unlock the full potential of their manufacturing systems and personnel, companies in many industries are rapidly moving toward highly automated systems and digital data-driven methods and tools....
View ArticleWhat’s Changing In Memory
As emerging big data and artificial intelligence (AI) applications, including machine learning, drive innovations across many industries, the issue of how to advance memory technologies to meet...
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Fab Equipment Challenges For 2019
After a period of record growth, the semiconductor equipment industry is facing a slowdown in 2019, in addition to several technical challenges that still need to be resolved. Generally, the equipment...
View ArticleBlog Review: Dec. 19
Cadence’s Dave Pursley checks out the state of high-level synthesis and notes that 39% of survey respondents expect to be using it for the majority of designs within three years. In a video, Mentor’s...
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Week In Review: Design
Deals eSilicon teamed up with Sunflower Mission once again to present 59 university scholarships for engineering and technology students in Vietnam. Foxconn, the huge Taiwanese contract manufacturer...
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Tariffs The United States and China are in the midst of a trade war. New data shows that tariffs on imported Chinese products now cost the technology industry an additional $1 billion per month,...
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What’s the Right Path For Scaling?
The growing challenges of traditional chip scaling at advanced nodes are prompting the industry to take a harder look at different options for future devices. Scaling is still on the list, with the...
View ArticleBlog Review: Jan. 2
Cadence’s Paul McLellan listens in as Uhnder CEO Manju Hegde explains the most critical issues impacting sensor development for autonomous vehicles and why new radar systems are needed to fill in the...
View ArticleManufacturing Bits: Jan. 2
Better nanowire MOSFETs At the recent IEEE International Electron Devices Meeting (IEDM), Imec and Applied Materials presented a paper on a new and improved way to fabricate vertically stacked...
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The Next Semiconductor Revolution
What will drive the next semiconductor revolution? When you ask people with decades of experience in semiconductor manufacturing and software development, the answers include everything from AI and...
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Chasing Reliability In Automotive Electronics
Assuring reliability in automotive electronics has set off a scramble across the semiconductor supply chain and unearthed a list of issues for which there is insufficient data, a lack of well-defined...
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Fab tools and materials Applied Materials is expected to remain the world’s largest semiconductor equipment supplier in terms of projected sales for 2018, according to a preliminary forecast of the...
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Keeping Up Power And Performance With Cobalt
Chip designers require simultaneous improvements in “PPAC”: power, performance and area/cost (Fig. 1). Achieving these improvements is becoming increasingly difficult as classic Moore’s Law scaling...
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Embedded Phase-Change Memory Emerges
The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been...
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Variation Issues Grow Wider And Deeper
Variation is becoming more problematic as chips become increasingly heterogeneous and as they are used in new applications and different locations, sparking concerns about how to solve these issues and...
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