The Week In Review: Manufacturing
German laser giant Trumpf is spending more than 70 million euros ($76.9 million) to build a new facility for its laser amplifier technology in EUV lithography applications. Trumpf has nothing to do...
View ArticleBigger, Brighter TVs
The flat panel display (FPD) industry is undergoing a renaissance, with suppliers rolling out a dizzying array of new, high-resolution technologies for mobile devices, computers and TVs. But despite...
View ArticleThe Week In Review: Manufacturing
According to Strategy Analytics, global mobile phone shipments grew a lackluster 2% annually to reach 435 million units in the second quarter of 2015. China’s Huawei was the star performer, as it...
View ArticleBlog Review: Aug. 5
Fresh from the July 2015 Type-C InterOp Event, where USB engineers wheel a prototype on a cart from hotel room to hotel room, testing interoperability, Synopsys’ Morten Christiansen says Type-C has...
View ArticleThe Week In Review: Manufacturing
Sunit Rikhi, vice president of the Technology and Manufacturing Group at Intel and general manager of Intel’s Custom Foundry unit, has retired. “I left Intel on a sabbatical in late March and ended my...
View ArticleIIoT Comes To Chip Manufacturing
Nicholas Ward, director of marketing for the services group at Applied Materials, sat down with Semiconductor Engineering to talk about how data needs to be shared in semiconductor manufacturing and...
View ArticlePatterning Interconnects At 10nm And Below
By Connie Duncan Chip manufacturers today build billions of transistors on a chip, delivering incredible computing power to consumers. What often gets overlooked is how hard it’s getting to create the...
View ArticleInterconnect Challenges Grow
It’s becoming apparent that traditional chip scaling is slowing down. The 16nm/14nm logic node took longer than expected to unfold. And the 10nm node and beyond could suffer the same fate. So what’s...
View ArticleAdvanced IC Packaging Biz Heats Up
After a number of false starts and lackluster adoption, the advanced IC packaging market is finally heating up. On one front, for example, a new wave of chips based on advanced 2.5D/3D stacked-die is...
View ArticleBlog Review: Sept. 2
When it comes to cars, manufacturers may be adding too many features too fast, says Mentor’s John Day. Up to half of the features may never get used either because they aren’t useful or they are too...
View ArticleThe Week In Review: Manufacturing
KKR, an investment firm, announced that it is leading a $42 million growth equity investment in Optimal+, a provider of manufacturing intelligence software solutions for adaptive IC test applications....
View ArticleMemory Hierarchy Shakeup
It’s no secret that today’s memory chips and storage devices are struggling to keep up with the growing demands in data processing. To solve the problem, chipmakers have been working on several...
View ArticleALD Market Heats Up
Amid the shift to 3D NAND, finFETs and other device architectures, the atomic layer deposition (ALD) market is heating up on several fronts. Applied Materials, for example, recently moved to shakeup...
View ArticleThe Week In Review: Manufacturing
In case you missed it, Apple rolled out its latest iPhones and other products. The latest iPhone 6 is using chips based on finFETs. So, who won Apple’s application processor foundry business for the...
View ArticleChasing After Quantum Dots
In the 1980s, researchers stumbled upon a tiny particle or nanocrystal with unique electrical properties. These mysterious nanocrystals, which are based on semiconductor materials, were later named...
View ArticleThe Week In Review: Manufacturing
Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing...
View ArticleThe Price Of Consolidation
Consolidation is causing far-reaching changes across the global semiconductor ecosystem due to the size of companies being bought and the dearth of startups to replenish those being acquired. Coupled...
View ArticleGaps Remain For EUV Masks
Extreme ultraviolet (EUV) lithography is once again at a critical juncture. The oft-delayed technology is now being targeted for 7nm. But there are still a number of technologies that must come...
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Manufacturing Of Next-Generation Channel Materials
One of the many challenges for the IC developers is to change the channel material to increase transistor mobility. But what about manufacturing? Can LED-style epitaxy be migrated to high-volume...
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Manufacturing Bits: Oct. 6
Magnetic mass spectrometers The National High Magnetic Field Laboratory (National MagLab) has developed a mass spectrometer, based on what the organization claims is the world’s highest field...
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