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Will China Succeed In Memory?
China’s fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China’s domestic vendors...
View ArticleBlog Review: Feb. 28
Mentor’s Matthew Ballance explains just what the portable stimulus standard makes portable. Cadence’s Dave Pursley considers why high-level synthesis is a good fit for cutting-edge machine learning...
View ArticleThe Week In Review: Manufacturing
Chipmakers and OEMs After more than four years as chief executive of GlobalFoundries, Sanjay Jha will hand over the company’s top position to Thomas Caulfield, senior vice president and general manager...
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More Lithography/Mask Challenges
Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and...
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Mixing 4G And 5G
5G networks will impact the number and types of ICs in end-user devices and the base stations used to transmit the signals (including the repeaters that rebroadcast those signals). And this is before...
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EUV’s New Problem Areas
Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue...
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The Bumpy Road To 5G
5G is coming, but not everywhere, not all at once, and not the fastest version of this technology right away. In fact, the probable scenario is that 5G will be rolled out first in densely populated...
View ArticleThe Week In Review: Manufacturing
Trade President Trump this week announced his decisions on the actions the administration will take in response to China’s alleged unfair trade practices covered in the USTR Section 301 investigation...
View ArticleTEL Sells Packaging Tool Unit
Tokyo Electron Ltd. (TEL) has signed a definitive agreement to sell its packaging equipment unit, TEL NEXX, to ASM Pacific Technology. With the proposed deal, ASM Pacific enters some new markets. ASM...
View ArticleThe Week In Review: Manufacturing
Trade wars China and the United States are in the midst of a trade war. Click here for the latest from CNN. Meanwhile, click here for a list of the winners and losers so far. Display Supply Chain...
View ArticleBlog Review: Apr. 11
Mentor’s Dennis Brophy looks at how the black box nature of IP means it’s hard to tell if a block is free from security risks, even if verification IP and open-source design code can help. Synopsys’...
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More Lithography/Mask Challenges
Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at Imec; Harry Levinson, senior fellow and...
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Searching For EUV Defects
Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this oft-delayed technology can be used in production. One lingering...
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New Patterning Options Emerging
Several fab tool vendors are rolling out the next wave of self-aligned patterning technologies amid the shift toward new devices at 10/7nm and beyond. Applied Materials, Lam Research and TEL are...
View ArticleToward A 5G, AI-Centric World
The market environment over the coming years will continue to experience an explosion of data generation from a variety of new sources such as smart cars, smart factories, smart hospitals and smart...
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FinFET Metrology Challenges Grow
Chipmakers face a multitude of challenges in the fab at 10nm/7nm and beyond, but one technology that is typically under the radar is becoming especially difficult—metrology. Metrology, the art of...
View ArticleThe Week In Review: Manufacturing
Fab tools and test VLSI Research released its annual “Customer Satisfaction Survey” and listed “THE BEST Suppliers” of 2018. VLSI Research received feedback from more than 94% of the chip market and...
View ArticleBlog Review: May 23
Cadence’s Paul McLellan digs into the problems of test for 3D ICs s well as new approaches to cell-aware test, modular test and realistic IR drop at CDNLive EMEA. Mentor’s Colin Walls shares four more...
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The Week In Review: Manufacturing
Chipmakers GlobalFoundries has announced that its 22nm FD-SOI technology platform has been certified to AEC-Q100 Grade 2 for production. As a part of the AEC-Q100 certification, devices must withstand...
View ArticleBlog Review: May 30
Cadence’s Paul McLellan listens in as Krste Asanović explains the history of AI and the birth of neural networks, the role of GPUs, and challenges for the future. Synopsys’ Amit Tyagi examines high...
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