The Week In Review: Manufacturing
Chipmakers Who will buy Toshiba’s memory business? In the latest of what is becoming a confusing saga, Toshiba has signed a deal to sell its memory unit to a group led by Bain Capital. The Bain-led...
View ArticleClik here to view.
The Week In Review: Manufacturing
Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the...
View ArticleBlog Review: Oct. 11
Mentor’s Matthew Balance examines the separation of concerns between test intent and test realization in the Portable Stimulus specification. Synopsys’ Deepak Nagaria checks out the features that makes...
View ArticleThe Week In Review: Manufacturing
Materials and equipment A scandal has rocked Japan’s Kobe Steel. The company disclosed that it has falsified inspection data for iron powder, aluminum and copper products that were sent to over 200...
View ArticleClik here to view.
Next-Gen Mask Writer Race Begins
Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the...
View ArticleClik here to view.
MEMS Market Shifting
The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this...
View ArticleClik here to view.
Improving Optical Overlay And Measurement
By Adam Ge and Shimon Levi Patterning challenges for the semiconductor industry are growing as the number of multi-patterned layers being used in the 10nm and beyond nodes increase. Patterning requires...
View ArticleClik here to view.
Searching For EUV Mask Defects
Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is...
View ArticleClik here to view.
Exploring New Scaling Approaches
At the recent SPIE Photomask Technology + Extreme Ultraviolet Lithography 2017 conference, Semiconductor Engineering sat down to discuss semiconductor technology with Tsu-Jae King Liu, the TSMC...
View ArticleClik here to view.
Manufacturing Bits: Oct. 24
Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the...
View ArticleBlog Review: Oct. 25
Mentor’s Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification. Cadence’s Paul McLellan listens in as AMD’s Mark Papermaster...
View ArticleThe Week In Review: Manufacturing
Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others...
View ArticleThe Week In Review: Manufacturing
Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group...
View ArticleClik here to view.
Overlay Challenges On The Rise
The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink. Both ASML and...
View ArticleClik here to view.
What’s Next For Atomic Layer Etch?
After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). ALE is is moving into 16/14nm, but it will...
View ArticleClik here to view.
Variation Spreads At 10/7nm
Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But...
View ArticleClik here to view.
Another Dimension For Virtual Reality
When you put on a virtual reality (VR) headset, you are connecting visually to another place—real or imagined. Most people connect VR with gaming, but increasingly business, industry and government...
View ArticleClik here to view.
The Week In Review: Manufacturing
Market research For some time, DRAM shortages have plagued the market. Today, the situation remains the same. DRAMs are seeing strong demand. But yet, vendors are not adding any capacity. “Strained...
View ArticleClik here to view.
The Week In Review: Manufacturing
Market research For the first time since 1993, the semiconductor industry has a new number one supplier in terms of sales—Samsung. Samsung is forecast to top Intel as the #1 semiconductor supplier in...
View ArticleBlog Review: Nov. 22
ARM’s Jem Davies talks about an upcoming documentary on AI and where the lines need to be drawn between machine intelligence and human emotional intelligence. Mentor’s Saunder Peng examines the impact...
View Article
